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DKT Technology roadmap

Category | Sortation | 2021 | 2022 | 2023 | 2024 |
---|---|---|---|---|---|
FPCB attachment tolerance | Attachment consistency | 0.07mm | 0.07mm | ±0.05 | ±0.05 |
TAPE attachment tolerance | Attachment consistency | 0.25mm | 0.25mm | 0.2mm | 0.2mm |
Minimum interval between CHIPs | Minimum interval between parts | 0.35mm | 0.3mm | 0.3mm | 0.3mm |
BGA Pitch | Fine PITCH | 0.5mm | 0.4mm | 0.4mm | 0.4mm |
Connector Pitch | Fine PITCH | 0.3mm | 0.3mm | 0.25mm | 0.25mm |
GLUE isolation technology | GLUE spread side | 0.7mm | 0.7mm | 0.5mm | 0.5mm |
Automated ET inspection | AUTO Align | 60% | 70% | 90% | 90% |