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TAPE ATTACH


- · Table rotation / HEAD X,Y,R axis movement
- · Vision recognition system (Error : ± 20㎛)
- · 2HEAD (Divided work system)

- · Yield data
- · Management of S/T and daily CAPA
- · Errors at present
Description of process | Effect |
---|---|
- Automatic attachment and discharge of tape by having tape absorbed from mounting FPCA on facilities | - Improvement of the defect rate from handling by avoiding contact when attaching FPCA. - Uniform quality of attachment |
E/T test

- · Connection of a single-item tester to automated facilities
- · Loading up on a tray and automatic discharge through the door

- · Yield data by CH
- · Management of S/T and daily CAPA
- · Checking of data log

Description of process | Effect |
---|---|
- Automatic picking and unloading of fine quality goods only by having FPCA mounted on facilities after conducting an E/T test (Automatic movement to a tray) |
- Improvement of the defect rate from handling by reducing handling processes - Prevention of fine quality goods from being mixed with defective ones |
SMT process capability

MOUNTER
- · CPH|200,000
- · Responsive part|0.2 x 0.1mm
- · Feature|High-speed rotary head

SPI (SOLDER PASTE INSPECTION)
- · Responsive part|0.4 x 0.2mm
- · Test items|Too little or excessive soldering work, height, OFFSET, BRIDGE, etc.

AOI (AUTOMATED OPTICAL INSPECTION)
- · Responsive part|0.4 x 0.2mm
- · Test items|Visual inspection on SMT parts
- · Feature|Shape matching / Histogram system
SMT attachment


- · X, Y, R, Z axis movement (Error: ± 50㎛)
- · Individual motion by head nozzle
- · Easy job change

- · Yield data (Insertion, discharge)
- · Management of S/T and daily CAPA
Description of process | Effect |
---|---|
- Inserting tray piled up with FPCB and a carrier jig into the facilities absorbs FPCB and places and discharges to the carrier jig automatically. | - Improvement of the defect rate from handling by avoiding contact when attaching FPCA. |