The highest technical ability with professionalism
최고의 연구진과 기술력으로 IT산업의 미래를 선도하겠습니다
디케이티 기술 로드맵
| 항목 | 구분 | 2021 | 2022 | 2023 | 2024 |
|---|---|---|---|---|---|
| FPCB attachment tolerance | Attachment consistency | 0.07mm | 0.07mm | ±0.05 | ±0.05 |
| TAPE attachment tolerance | Attachment consistency | 0.25mm | 0.25mm | 0.2mm | 0.2mm |
| Minimum interval between CHIPs | Minimum interval between parts | 0.35mm | 0.3mm | 0.3mm | 0.3mm |
| BGA Pitch | Fine PITCH | 0.5mm | 0.4mm | 0.4mm | 0.4mm |
| Connector Pitch | Fine PITCH | 0.3mm | 0.3mm | 0.25mm | 0.25mm |
| GLUE isolation technology | GLUE spread side | 0.7mm | 0.7mm | 0.5mm | 0.5mm |
| Automated ET inspection | AUTO Align | 60% | 70% | 90% | 90% |
